Force Sensors For Microelectronic Packaging Applications Michael Maier
| Use attributes for filter ! | |
| Published | October 21, 2004 |
|---|---|
| Authors | Michael Mayer |
| Oliver Brand | |
| Jeurg Schwizer | |
| Media actions | www.worldcat.org |
| Get book actions | www.worldcat.org |
| Wholepage author card | Jeurg SchwizerWriter |
| Date of Reg. | |
| Date of Upd. | |
| ID | 4033617 |
About Force Sensors For Microelectronic Packaging Applications Michael Maier
Intended for wire-bonding and flip-chip packaging professionals and for scientists and engineers working in the field of mechanical microsensors, this practical monograph introduces novel measurement ...