Design For High Performance, Low Power, And Reliable 3D Integrated Circuits
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| Google books | books.google.com |
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| Originally published | April 2, 2012 |
| Authors | Sung Kyu Lim |
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| Date of Upd. | |
| ID | 2126357 |
About Design For High Performance, Low Power, And Reliable 3D Integrated Circuits
This book describes the design of through-silicon-via (TSV) based three-dimensional integrated circuits. It includes details of numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs, developed with tools covered in the book. . . .